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cadence.com

Cadence is a leading EDA and Intelligent System Design provider delivering hardware, software, and IP for electronic design.

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What is Cadence?

Cadence is a provider of electronic design automation (EDA) and computational software used to design and verify complex electronic systems. Its tools and intellectual property (IP) support work across chip, package, board and system levels, and are typically used by semiconductor companies, electronics manufacturers and design teams working on system-on-chip (SoC) and related products.

Its offering broadly covers:

  • Digital and analog/mixed-signal design — tools for creating, simulating and implementing integrated circuits.
  • Verification — hardware and software for checking that designs behave as intended before manufacture.
  • IP blocks — reusable design components that teams can integrate into their own chips.
  • Multiphysics analysis and engineering simulation — software for studying physical behaviour such as thermal or electromagnetic effects.
  • System and PCB design — support for packaging, boards and complete electronic systems.

Cadence is suited to engineering organisations that need an integrated toolchain from concept through signoff, rather than a single point tool. The trade-off is that such platforms can involve significant setup, training and licensing investment, so they tend to fit professional design flows more than casual or hobby use. The site notes a free trial, which may help prospective users evaluate whether the tools match their needs.

For official information, see Cadence.

What is Electronic Design Automation (EDA) and how does Cadence fit into it?

Electronic Design Automation (EDA) is the category of software used to design, verify and prepare complex electronics for manufacturing. Instead of drawing circuits by hand, engineers describe behaviour or structure in code, then rely on tools to simulate, check and lay out the design. EDA matters most where complexity is high: system on chip (SoC), custom integrated circuits, advanced packaging and boards.

Cadence operates in this space as a supplier of EDA tools, hardware and semiconductor intellectual property (IP), positioned around what it calls Intelligent System Design. Its portfolio typically spans:

  • Digital and analogue/mixed-signal design — from RTL through implementation and signoff.
  • Verification — simulation, emulation and formal methods to catch bugs before fabrication.
  • IP blocks — reusable interface and processor cores that teams integrate rather than build.
  • Multiphysics analysis and simulation — checking thermal, electromagnetic and mechanical behaviour.
  • AI-assisted optimisation — using machine learning to tune design flows and results.

Who it suits. Chip designers, verification engineers and system teams at semiconductor and electronics companies. The trade-off is familiar: powerful, integrated flows reduce risk and iteration time, but demand specialist skills, significant compute resources and licensing investment. Smaller teams may prefer narrower point tools or open-source alternatives, while large SoC programmes usually need broad, well-supported platforms like Cadence. A free trial is referenced as an entry point, though scope and terms are not specified here.

What products and tools does Cadence offer for system-on-chip (SoC) design?

Cadence provides electronic design automation (EDA) software, hardware and intellectual property (IP) used across the SoC flow, from early architecture through verification and implementation. Its tools are typically grouped by design stage rather than sold as a single package.

Major tool areas

  • Digital design and implementation: logic synthesis, place-and-route, and signoff tools for digital SoCs, including timing and power analysis.
  • Verification: simulation, formal verification, emulation and prototyping hardware used to validate designs before fabrication. Emulation is often chosen for large SoCs where simulation alone is too slow.
  • Analog and mixed-signal: custom IC design and simulation tools for blocks such as PLLs, ADCs and SerDes.
  • IP portfolio: pre-built interface, memory and processor-related IP that teams can integrate to reduce development time.
  • Advanced packaging and system analysis: multi-physics and thermal/electrical analysis for chiplet and package-level designs.

Who uses it

These products mainly suit chip designers, verification engineers and system architects at semiconductor and electronics companies. Smaller teams may find the full flow expensive and complex; they sometimes adopt individual tools or IP rather than the entire suite. Cadence also offers a free trial for some products, so evaluation before commitment is possible, though pricing is not published here.

For official details, see Cadence.

How does Cadence incorporate artificial intelligence into its design solutions?

Cadence applies artificial intelligence across its electronic design automation (EDA) and intelligent system design offerings, mainly to make chip, package and system development faster and more predictable.

H3 Where AI appears in the flow

  • Design optimization: AI-driven engines can explore large option spaces for logic, placement, routing and timing, aiming to reach quality-of-results targets with fewer manual iterations.
  • Verification and debug: Machine learning may help triage failures, cluster similar bugs and suggest likely root causes, which suits large system-on-chip projects with heavy regression suites.
  • Simulation and multiphysics analysis: AI-assisted models can accelerate or approximate expensive engineering simulations, useful when teams need early trade-off studies before full signoff.
  • IP and system-level work: AI is also presented as part of broader intelligent system design, connecting hardware, software and IP decisions rather than treating them as isolated steps.

H3 Who benefits and trade-offs The main audiences are chip designers, verification engineers, physical design teams and system architects working on complex SoCs. The appeal is shorter schedules and less repetitive manual tuning. Trade-offs typically include dependence on data quality, the need to validate AI-generated results against trusted signoff flows, and integration effort into existing methodologies. Cadence presents these capabilities as part of its commercial EDA platform rather than standalone research.

For official details, see Cadence.

What is Cadence's role in multi-physics analysis and engineering simulation?

Cadence provides electronic design automation (EDA) software and related hardware, software and intellectual property (IP) for designing complex electronics such as systems on chip. Within that portfolio, its role in multi-physics analysis and engineering simulation is to help engineers check how a design behaves across several physical effects—typically thermal, electromagnetic, mechanical and electrical interactions—before committing to manufacture.

Where it fits

  • Chip and package design: Simulation supports signal integrity, power integrity, thermal behaviour and electromagnetic compatibility, which matter as devices shrink and run hotter.
  • System-level work: Multi-physics checks help verify that chips, packages and boards work together rather than in isolation.
  • AI-assisted flows: Cadence markets artificial intelligence as part of its design and simulation offering, which may speed up optimisation and design-space exploration.

Trade-offs

These tools are aimed at professional engineering teams, so they typically involve steep learning curves, significant compute resources and commercial licensing. That makes them less suited to casual or hobby use. Teams already inside a Cadence EDA flow may gain from tighter integration between design and simulation, while others may prefer specialist simulation vendors for particular physics domains.

For official product details, see Cadence. A free trial is signalled, but pricing is not stated here.

Does Cadence offer a free trial or evaluation version of its software?

Cadence's site indicates a free trial is available, though the scope depends on the product. The company provides electronic design automation (EDA) tools, semiconductor intellectual property (IP), and simulation and analysis software used across chip, package, board and system design.

What a trial typically covers

  • Individual tools or tool suites rather than the entire portfolio
  • Evaluation licenses that may be time-limited or feature-limited
  • Access intended for qualified engineers, often at companies or academic institutions

Who it suits

  • Design teams assessing whether a tool fits an existing flow
  • Engineers comparing simulation accuracy or ease of integration
  • Researchers and students exploring EDA or multi-physics analysis

Trade-offs to expect

Trials for professional EDA software commonly involve registration, eligibility checks and sometimes an account manager, because licenses are expensive and support-intensive. Evaluation versions may exclude advanced features, certain process libraries or full IP access, so results can differ from a production setup. The public site does not list prices or trial durations, so confirm availability and terms directly with Cadence for the specific product you need.

For official details, see Cadence.

Related questions

More questions →
What Is EDA Design?

EDA design is the practice of using Electronic Design Automation software to create, simulate, verify, and prepare electronic systems—most notably integrated circuits and systems on chip (SoCs)—for manufacturing. It applies when a design is too large or complex to capture and check by hand: modern chips contain billions of transistors, and every stage from logic definition to final layout signoff depends on specialized tools. Cadence, as an EDA and Intelligent System Design provider, supplies hardware, software, and IP across this flow.

The core idea

Instead of drawing circuits manually, engineers describe intended behavior in a hardware description language, then let tools translate, optimize, and check that description at each level of abstraction. The output is a set of manufacturing files (such as GDSII) plus evidence that the design meets its functional, timing, power, and physical requirements.

Main stages of an EDA design flow

The flow is usually described as moving from abstract logic toward a manufacturable physical layout.

Stage What happens Typical tools
Design entry / RTL Behavior written in Verilog, VHDL, or SystemVerilog RTL editors, linters
Functional verification Simulation and formal checks confirm the logic matches intent Simulators, formal verification, emulation
Logic synthesis RTL converted into a gate-level netlist mapped to a library Synthesis tools
Physical implementation Placement and routing of cells on the die Place-and-route tools
Timing and power analysis Static timing analysis and power checks across corners STA, power analysis
Physical verification & signoff Design rule checks, layout vs. schematic, final approval DRC/LVS, signoff tools

Each stage feeds the next, and errors found late are far more expensive than errors found early—which is why verification consumes a large share of project effort.

Why simulation and verification matter

Manufacturing a chip involves masks and fabrication runs that cannot be quickly or cheaply undone. Simulation lets engineers exercise the design against testbenches before any silicon exists, while formal methods prove properties across many possible states. Static timing analysis then checks whether signals arrive within required windows under different process, voltage, and temperature conditions. Together these steps catch functional bugs, timing violations, and power problems while they are still fixable in software.

SoC and IP reuse

A System on Chip integrates processors, memory, interfaces, and specialized blocks on one die. Rather than designing every block from scratch, teams assemble a SoC from reusable IP—pre-designed and pre-verified functional blocks. EDA tools support this by providing consistent interfaces, integration and verification environments, and analysis that treats the assembled SoC as a whole. This reuse is what makes complex SoCs practical within realistic schedules.

How AI and multi-physics analysis are changing the workflow

Two shifts are visible in current EDA practice:

  • AI-assisted design. Artificial intelligence is applied to optimization, design space exploration, and verification productivity, helping teams search large solution spaces faster than manual iteration.
  • Multi-physics analysis. Chips and the systems around them interact with thermal, electromagnetic, and mechanical effects. Multi-physics and engineering simulation extend analysis beyond pure logic and timing so that these physical interactions are considered during design.

These capabilities complement, rather than replace, the established flow: the stages above still apply, but with more automated optimization and broader physical modeling.

Where to start

If you are new to the field, begin with the flow rather than a single tool: learn how RTL becomes a netlist, how simulation validates behavior, and how timing and physical checks gate signoff. From there, explore how SoC integration and IP reuse scale the same principles, and how AI and multi-physics analysis are being layered onto them.

What Is a System on Chip (SoC)?

A System on Chip (SoC) is an integrated circuit that combines the major functional blocks of a complete electronic system—processor cores, memory, interconnect, peripherals, and often accelerators—onto a single die or package. It differs from a traditional printed circuit board (PCB) design, where those functions live in separate chips connected by board traces. SoCs matter because they reduce size, power, and latency while improving bandwidth between components, which is why they dominate smartphones, automotive electronics, and embedded devices. The trade-off is complexity: designing an SoC requires IP integration, verification, and a disciplined flow from specification to tape-out, typically supported by EDA tools.

SoC vs. a traditional PCB-based system

Dimension PCB-based system System on Chip
Physical integration Multiple discrete chips on a board Blocks integrated on one die or in one package
Interconnect Board traces, external buses On-chip buses and networks
Size and power Larger, higher board-level power Smaller, generally lower power for the same function
Performance Limited by off-chip communication Higher on-chip bandwidth, lower latency
Flexibility Easy to swap or upgrade parts Fixed after fabrication; changes require a new design
Design effort Board design and component selection IP selection, integration, verification, and physical implementation

The practical rule: choose an SoC approach when volume, power, size, or performance justify the design cost. For low-volume or highly modular products, a PCB-based system is often more economical.

Core building blocks of an SoC

Most SoCs assemble some combination of the following:

  • Processing cores — CPU cores for general computation, and often GPU, DSP, or NPU blocks for graphics, signal processing, or AI workloads.
  • Memory — on-chip SRAM, cache, and interfaces to external DRAM or flash.
  • Interconnect — on-chip buses or a network-on-chip (NoC) that moves data between blocks.
  • Peripherals and I/O — USB, Ethernet, PCIe, display, camera, and other interfaces.
  • Accelerators — fixed-function or configurable hardware for tasks such as video encoding, cryptography, or machine learning.
  • Clock, power, and test infrastructure — PLLs, power domains, and debug/scan logic.

Not every SoC includes every block. A microcontroller-class SoC may have a single CPU core and minimal peripherals, while a mobile SoC may integrate many cores, a GPU, and multiple accelerators.

Why IP reuse and EDA tools matter

Modern SoCs are rarely designed from scratch. Design teams license or reuse semiconductor IP—pre-designed and pre-verified blocks such as CPU cores, memory controllers, and interface PHYs—and integrate them. IP reuse shortens schedules and reduces risk, but it shifts the challenge to integration: making blocks from different sources work together, meet timing, and pass verification.

EDA (Electronic Design Automation) tools support this process. Cadence describes itself as an EDA and Intelligent System Design provider delivering hardware, software, and IP for electronic design, which reflects the typical toolchain role: design capture, simulation, verification, implementation, and signoff. In practice, EDA tools are how teams manage the scale of an SoC—billions of transistors and many interacting blocks—without relying on manual analysis.

Typical SoC design flow

The exact flow varies by team and process node, but a common sequence is:

  1. Specification — define target applications, performance, power, area, and interfaces.
  2. Architecture and IP selection — choose cores, memory, interconnect, and peripherals; decide what to license versus design in-house.
  3. RTL design and integration — write or integrate register-transfer level (RTL) code for the blocks and connect them.
  4. Functional verification — simulate and formally verify that the design behaves as specified, including block-level and system-level tests.
  5. Physical implementation — synthesis, floorplanning, placement, clock tree synthesis, and routing.
  6. Signoff — timing, power, and physical verification checks to confirm the design meets constraints.
  7. Tape-out — release the design for fabrication.

Verification method: each stage has its own checks—simulation and coverage metrics for functional verification, static timing analysis for timing, and design rule checks for physical signoff. A design is ready for tape-out when these checks pass against the specification.

Common sticking points: IP integration mismatches, timing closure at advanced nodes, power budget overruns, and verification gaps that only appear at system level. These are usually addressed with early architecture modeling and incremental verification rather than at the end of the flow.

Real-world examples

  • Smartphones — a mobile SoC integrates CPU cores, a GPU, memory controllers, image signal processing, and wireless interfaces into one package.
  • Automotive — SoCs handle infotainment, advanced driver assistance, and increasingly centralized vehicle computing, where reliability and long product lifetimes matter.
  • Embedded devices — microcontroller-class SoCs power appliances, industrial sensors, and wearables where cost, power, and size are primary constraints.

The common thread: the application's requirements—performance, power, size, and volume—determine whether an SoC is the right choice and which blocks it should integrate.

What Are EDA Tools and What Do They Do?

EDA tools are software applications that automate the design, verification, and physical implementation of electronic systems — most notably integrated circuits and printed circuit boards. They matter most when a design is too large or too complex to check by hand: a modern system on chip (SoC) can contain billions of transistors, and every one of them has to be functionally correct, manufacturable, and timing-clean before it is fabricated. If you are trying to place a vendor product or choose a first tool, the useful mental model is a flow, not a list: each tool consumes a specific data format, performs one transformation, and hands off to the next stage.

The core job: turn intent into a manufacturable layout

An EDA flow starts with a description of what the circuit should do and ends with a layout file a foundry can build. Along the way, tools translate between levels of abstraction:

  • Behavioral / RTL — the designer writes register-transfer level code (commonly Verilog, SystemVerilog, or VHDL) describing logic and state.
  • Gate-level netlist — synthesis converts RTL into a connection of standard cells from a technology library.
  • Physical layout — place-and-route positions those cells and draws the metal wiring between them.
  • GDSII / OASIS — the final mask-level geometry delivered to the foundry.

Each arrow in that chain is a tool category, and each category exists because the previous stage's output is too abstract or too large to be used directly.

Main tool categories

Category What it does Typical input → output
Design entry & simulation Captures RTL and checks functional behavior against a testbench RTL + testbench → waveforms, pass/fail
Synthesis Maps RTL to a gate-level netlist using a target library RTL + constraints → netlist
Place-and-route (P&R) Places cells and routes wires to meet timing, area, and power goals Netlist + constraints → layout
Functional verification Proves the design matches its specification (simulation, formal, emulation) RTL/netlist + properties → coverage, proofs
Physical verification Checks that the layout obeys manufacturing rules and matches the netlist Layout → DRC/LVS reports
Signoff & analysis Final timing, power, noise, and multi-physics checks before tapeout Layout + parasitics → signoff reports

The categories overlap in practice — some tools bundle simulation and debug, others combine P&R with built-in timing analysis — but the underlying transformations are stable across vendors.

Front-end vs. back-end

The flow splits into two halves, and the split explains most tool-selection questions:

  • Front-end (logical) tools work on RTL and netlists. They are relatively process-independent: the same simulator runs whether you target 7 nm or 180 nm. Verification dominates here, and it usually consumes the largest share of engineering effort.
  • Back-end (physical) tools work on layout and depend heavily on the target process. Place-and-route, extraction, and physical verification must be calibrated to a specific foundry's design rules and libraries.

A practical consequence: front-end tool choices are often driven by language support, debug quality, and verification methodology; back-end choices are driven by process-node support and foundry certification.

How tools hand off data

Tools from different vendors interoperate because the industry standardized the interfaces between stages. Common handoff formats include:

  • Verilog / SystemVerilog / VHDL for RTL and netlists
  • SDC (Synopsys Design Constraints) for timing and design intent
  • LEF / DEF for abstract cell views and placed-and-routed design data
  • GDSII / OASIS for final layout
  • SPEF for extracted parasitics used in signoff timing

When you evaluate a tool, one of the first questions is which of these formats it reads and writes, and whether its output is accepted by the next tool in your flow. A tool that is excellent in isolation but breaks the handoff creates manual work that erases its advantage.

Criteria for choosing or evaluating a tool

Use the same dimensions regardless of vendor:

  1. Process-node and library support — does it support the node and foundry libraries you actually target?
  2. Foundry certification — for back-end and signoff tools, is the tool qualified for that process? Uncertified signoff results may not be accepted.
  3. Flow integration — does it read/write the standard formats above, and does it fit your existing flow?
  4. Capacity and performance — can it handle your design size within your runtime and memory budget?
  5. Debug and usability — how quickly can an engineer find the root cause of a failure? This often dominates total cost.
  6. Cost model — licensing (node-locked, floating, subscription) and any available trial access. Cadence, for example, lists a free trial among its pricing signals; confirm current terms directly with the vendor, since pricing and access conditions are not specified here.

A concrete example

Suppose you are designing a small SoC block. You write SystemVerilog RTL and simulate it with a testbench to confirm the logic behaves correctly. Once functional bugs are cleared, synthesis maps the RTL to gates from your foundry's standard-cell library. Place-and-route then positions those gates and routes the wires, and the tool's built-in timing engine checks whether signals arrive in time. Finally, physical verification confirms the layout matches the netlist (LVS) and obeys the foundry's design rules (DRC), and signoff timing with extracted parasitics confirms the design is ready for tapeout. Every step used a different tool category, and each one passed data to the next through a standard format.

Where to go next

If you are new to the field, start by understanding the two foundational concepts behind the flow: what EDA design is and what a system on chip is. Those give you the vocabulary to read any vendor's tool documentation and place each product in the flow above.

What Is Electronic Design Automation (EDA)?

Electronic Design Automation (EDA) is the category of software used to design, simulate, verify, and prepare electronic systems—most notably integrated circuits (ICs) and printed circuit boards (PCBs)—for manufacturing. You need EDA when a design is too large or too complex to create and check by hand: modern chips contain billions of transistors, and a single missed connection or timing error can make a chip non-functional. EDA tools turn a human-readable design description into a verified, manufacturable layout, and they provide the simulation and analysis needed to catch problems before fabrication.

Why EDA Exists

A modern System on Chip (SoC) integrates processors, memory, interfaces, and specialized IP blocks on one die. Designing that by hand is not feasible. EDA addresses three fundamental problems:

  • Scale — billions of transistors must be placed and connected correctly.
  • Verification — the design must be proven to behave correctly under many conditions before it is built.
  • Manufacturability — the physical layout must satisfy the foundry's manufacturing rules.

EDA is therefore not a single program but a chain of specialized tools, each handling one stage of the flow.

The Main EDA Tool Categories

EDA tools map to stages of a design flow. The table below shows the typical categories and what each does.

Stage Tool category What it does
Design entry HDL entry / schematic capture Captures the design as RTL (e.g., Verilog, VHDL) or a schematic
Functional verification Simulation Checks that the design's logic behaves as intended
Implementation Synthesis Converts RTL into a gate-level netlist
Implementation Place-and-route Positions cells and routes the connections between them
Verification Formal / static checks Proves properties or checks for structural issues without simulation
Physical signoff Timing, power, physical verification Confirms the layout meets timing, power, and manufacturing rules
PCB design Schematic and layout tools Designs and routes board-level circuits

The exact boundaries vary by vendor and flow, but the sequence—describe, simulate, synthesize, place and route, verify, sign off—is consistent.

How EDA Fits the Broader Flow

A typical chip design flow moves from abstract to physical:

  1. RTL and IP blocks — Designers write or reuse IP (intellectual property) blocks described in a hardware description language.
  2. Simulation — The RTL is simulated to confirm functional correctness.
  3. Synthesis — The RTL is converted into a netlist of logic gates.
  4. Place-and-route — Gates are physically placed on the die and wired together.
  5. Verification and signoff — Timing, power, and physical checks confirm the design can be manufactured and will work.
  6. Manufacturing handoff — The final layout (GDSII) is sent to the foundry.

For PCBs, the flow is analogous but ends in a board layout rather than a silicon mask.

EDA vs. Related Terms

These terms are often used interchangeably, but they are not identical:

  • EDA — the overall field and the software category.
  • EDA tools — the specific programs used within that field (simulators, synthesis tools, routers, etc.).
  • EDA design — the act or process of designing electronics using EDA tools.
  • SoC design — a specific application of EDA: designing a complete system on a single chip, typically combining multiple IP blocks.

In short: EDA is the field, EDA tools are the instruments, EDA design is the activity, and SoC design is one important target of that activity.

What to Look For in EDA Software

When evaluating EDA tools, consider:

  • Coverage of the flow — does the vendor cover entry, simulation, implementation, and signoff, or only one stage?
  • IP availability — reusable IP blocks can shorten design time.
  • Verification depth — simulation, formal, and static checks address different classes of bugs.
  • Manufacturing support — signoff tools must match the target foundry's rules.
  • Integration — tools that share data models reduce manual handoffs between stages.

Cadence, for example, describes itself as an EDA and Intelligent System Design provider delivering hardware, software, and IP for electronic design, with capabilities spanning SoC design, simulation, multi-physics analysis, and AI-assisted design. Availability, licensing, and trial terms vary by product, so confirm current details directly with the vendor.

Website Overview

An established domain and managed infrastructure suggest continuity of operations and may support dependable delivery, although neither guarantees service quality.

Domain and Registration

Registered in 1989, this domain has about 37 years of history. That suggests continuity, although ownership and purpose may have changed. The registrar, CSC Corporate Domains, Inc., specializes in corporate domain and brand management, suggesting attention to domain asset protection. Transfer-protection status is present, helping reduce the risk of unauthorized domain transfers. The domain uses the common .com extension, which is not an independent safety signal.

DNS and Email

Nameservers are provided by Cloudflare, indicating managed DNS hosting. MX records point to the Proofpoint email service. DNSSEC is enabled, allowing validating resolvers to authenticate signed DNS data. No CNAME was found; the observed records resolve directly to addresses. SPF and DMARC are configured. DKIM status is unknown.

TLS and Certificates

The public key uses EC with 256 bits. The server supplied a complete certificate chain. No organization name is present in the certificate; the available fields are consistent with domain validation. The certificate was issued within the Google Trust Services cloud or CDN ecosystem. The certificate's total validity is about 90 days, consistent with a short renewal cycle.

HTTP and Browser Security

The response lacks these common security headers: Referrer-Policy, Permissions-Policy. CORS permits any origin to read this response. This is common for public resources; sensitive responses need narrower handling. No X-Powered-By header was found, reducing one common source of backend fingerprinting information. The cf-ray response header indicates a CDN or caching proxy in the delivery path. No obvious internal addresses or debug information were found in the headers.

Technology Stack Analysis

The public page identifies Cloudflare without precise versions, leaving fewer clues for version-specific scanning.

Search and Social Sharing

Unknown

Hosting and Email

DNSCloudflare
HostingCloudflare
EmailProofpoint
Approximate IP geolocation (inferred; a CDN or proxy may differ from the origin server) Location unknown Inferred 104.16.123.199

Registration details

RDAP / WHOIS

RegistrarCSC Corporate Domains, Inc.
Registered1989-04-14
Expires2027-04-15
Domain statusclient transfer prohibited、server delete prohibited、server transfer prohibited、server update prohibited
Nameserversmajor.ns.cloudflare.com、olga.ns.cloudflare.com
DNSSECsigned

DNS records

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TXTcadence.comhpe-greenlake-domain-verification=353648697370746e625955566e526e447a7939544279344b3856413872553477300—
TXTcadence.comibmid=9d8592c0-f4ce-497a-b4fa-5553a8b7e8d3300—
TXTcadence.comidentrust_validate=Iev41uEck3ed9cYdKzL20j3VeHOiEVNebmwszu3JO8XD300—
TXTcadence.comidentrust_validate=tD3b6I/bkQrqT9lpf387uPCaTnw6Yh/L5Ms9UR3zJAIy300—
TXTcadence.compaloaltonetworks-site-verification=b3a8a8a5290fe964c0302c6b0133bbb65b32a683b3eaf4318d9170aace1fdb24300—
TXTcadence.comv=spf1 include:%{ir}.%{v}.%{d}.spf.has.pphosted.com ~all300—
TXTcadence.comwebexdomainverification.4C675B8A134DB136E053AB06FC0A3F65=b8c99280-ddda-4c3f-9f57-e88e638ce48e300—
TXTcadence.comwebexdomainverification.6c2298870a7d1cc1e053ad06fc0a1650=73e5e2d3-d9f2-44a1-9eb1-ce81017590bc300—
DScadence.com2371 13 2 815c57cca7b52796798285fb68272ce501a857fc56180852777f6ad9bfd9f1cc86400—
DMARC_dmarc.cadence.comv=DMARC1; p=reject; fo=1; rua=mailto:[email protected]; ruf=mailto:[email protected]1800—

TLS and certificates

TLS / SSL

AssessmentNormal configuration
Supported protocolsTLSv1.2
Negotiated protocolTLSv1.2
Certificate subjectcadence.com
IssuerGoogle Trust Services
Valid until2026-11-26T16:29 · Remaining when checked: 64 days
Verification detailsCertificate trust: Passed · Hostname match: Passed

HTTP response headers

HTTP

HeaderValue
content-typetext/html; charset=UTF-8
cache-controlpublic, max-age=7200
servercloudflare
strict-transport-securitymax-age=31536000; includeSubDomains
content-security-policyframe-ancestors 'self' https://cadence.pathfactory.com https://paths.pcb.cadence.com https://resources.pcb.cadence.com https://resources.orcad.com ;
x-frame-optionsSAMEORIGIN
x-content-type-optionsnosniff
access-control-allow-origin*

Identified technologies

Cloudflare

Pages, Search and Sharing

Meta descriptionCadence is a leading EDA and Intelligent System Design provider delivering hardware, software, and IP for electronic design.
Canonical URLNot detected
LanguageEnglish (default) · Multilingual
Twitter CardNot detected

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